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NoorTech

NoorTech Malaysia Sdn. Bhd. · Malaysia

Let AI Bring Machines to Life

A Malaysian chip company designing high-compute SoCs for vehicles, robots, the cloud and aerospace, with self-developed NPU IP, an in-house compiler, and an advanced packaging and test capability growing alongside.

Read about the company
Sky · Cloud · Edge: one platform, every machine Aerospace Cloud Vehicles Robotics NOORTECH SOC · NPU
Sky · Cloud · Edge: one platform, every machine

01 / 03

What we do

01 Wholly owned

Computing chip design

Our core business. High, mid and low-end computing chips built on self-developed NPU core IP, with full SoC architecture and system verification held in-house rather than outsourced.

02 Joint venture

Automotive chip testing

A joint venture developing vehicle-grade test capability alongside the products it qualifies, closing the loop between design and certification instead of waiting on third parties.

03 Joint venture

Advanced packaging

A strategic footprint in 2.5D and 3D packaging, the capability that increasingly decides how much performance a design can actually deliver.

02 / 03

The integrated platform

Hardware

“Depth” NPU subsystem

A ring-bus computing architecture keeping compute, memory and host processor close together, so utilisation holds up on real workloads rather than only on benchmark kernels.

Software

“Ladder” compiler

An integrated RISC-V and NPU compiler: graph optimisation, operator fusion and instruction scheduling, the last mile that lets existing models run on our silicon without teams changing how they work.

Discipline

Automotive-grade flow

The full development flow runs to ISO 9001, and automotive products are developed to conform to ISO 26262. The bar that earns a place in a vehicle.

Company

Building a world-leading computing-chip cluster, from Malaysia outward.

Incorporated in April 2026 with RM 10,000,000 in registered capital, NoorTech is rooted in automotive compute and reaching globally, with R&D centres being established in China, North America, Europe and Japan, and joint ventures forming in packaging and test.

Headquarters in Malaysia, with R&D centres being registered in China, Japan, Europe and North America. China Japan Europe North America Malaysia
Headquarters R&D centres, in registration
Incorporated
2026
Registered capital
RM 10,000,000
Headquarters
Malaysia
R&D centres, in registration
Four regions

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Leadership

Hawk

SoC Architecture

20+ years in IC. Deputy Chief Engineer, Technical Director, CTO & Deputy GM of an automotive BU. Core contributor to HiSilicon Kirin AI IP.

Jason

NPU Architecture

Former AI chief expert at Huawei Smart Engineering. Lead architect on a first-generation cloud LLM inference chip. Former NPU architect at Qualcomm and NIO.

Oliver

NPU Compiler

PhD in compilation, Chinese Academy of Sciences. Led NPU architecture for a high-compute ADAS chip at sparse INT8 above 1000T.

Steven

SoC Design

15 years and 10+ mass-production chip programmes. Most recently responsible for cloud-side high-compute SoC architecture and design.

James

Software Solutions

20 years in chip system software across multimedia and AI, spanning edge-side and cloud-side high-compute inference.

Zora

Hardware Solutions

16 years in post-silicon test and hardware architecture. Automotive-grade certification across multiple vehicle-grade chips.

Contact

Let AI Bring Machines to Life

Partners, investors and engineers: we would like to hear from you.

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